4.7 Article

Numerical investigation of heat transfer in structured rough microchannels subjected to pulsed flow

期刊

APPLIED THERMAL ENGINEERING
卷 197, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2021.117361

关键词

mu-channels; MCHS; CFD; Pulsed flow; BeCu

资金

  1. Department of Science and Technology, Government of India [DST-SERB EMR/2016/003372]

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This study investigates the effect of pulsed flow in microchannels on cooling performance of electronic components, finding that pulsating flow outperforms continuous flow with a significant enhancement in heat transfer. Pulsed flow generates vortices in the fluid, enhancing heat transfer efficiency, while wall roughness assists heat transfer but leads to increased pressure drop. These findings suggest that pulsating flow may be a suitable choice for microchannel electronic liquid cooling systems.
Heat sinks are popular devices for cooling of electronic components, and their performance can be enhanced by flowing a cooling fluid through micro-scale channels. While previous works concentrated on continuous flow of coolant through channels, in this work effect of pulsed flow through microchannels is studied. Further, the effect of structured wall surface roughness is also considered. Full factorial experiments are designed with channel hydraulic diameter and wall roughness as parameters with 3 levels each and 2D simulations are performed for all cases. Initial comparison indicates better performance in pulsed flow against continuous with a maximum enhancement of 32.76% in average Nusselt number. Unlike continuous flow, pulsed flow is found to create vortices in fluid irrespective of wall roughness which enhances heat transfer. Optimum pulse frequency is found to vary with hydraulic diameter but is independent of wall roughness. Wall roughness is found to assist heat transfer for all channels however with a pressure drop penalty. Maximum increment of 29.29% in average Nusselt number due to wall roughness is observed for hydraulic diameter of 300 mu m, when roughness is increased from 0 to 50 mu m. Increasing hydraulic diameter is found to be detrimental to heat transfer and a maximum reduction of 29.10% in average Nusselt number is observed on increasing diameter from 300 to 700 mu m at constant wall roughness. Based on the results, a pulsating flow may be adopted for microchannel based electronic liquid cooling systems.

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