Development and experimental study of a 3-dimensional enhanced heat pipe radiator for cooling high-power electronic devices

标题
Development and experimental study of a 3-dimensional enhanced heat pipe radiator for cooling high-power electronic devices
作者
关键词
-
出版物
APPLIED THERMAL ENGINEERING
Volume -, Issue -, Pages 121924
出版商
Elsevier BV
发表日期
2023-11-05
DOI
10.1016/j.applthermaleng.2023.121924

向作者/读者发起求助以获取更多资源

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started