Development and experimental study of a 3-dimensional enhanced heat pipe radiator for cooling high-power electronic devices
出版年份 2023 全文链接
标题
Development and experimental study of a 3-dimensional enhanced heat pipe radiator for cooling high-power electronic devices
作者
关键词
-
出版物
APPLIED THERMAL ENGINEERING
Volume -, Issue -, Pages 121924
出版商
Elsevier BV
发表日期
2023-11-05
DOI
10.1016/j.applthermaleng.2023.121924
参考文献
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