4.5 Article

Effect of Substrate Alloy Type on the Microstructure of the Substrate and Deposited Material Interface in Aluminium Wire plus Arc Additive Manufacturing

期刊

METALS
卷 11, 期 6, 页码 -

出版社

MDPI
DOI: 10.3390/met11060916

关键词

additive manufacturing; aluminum; direct energy deposition; Wire plus Arc additive manufacturing

资金

  1. C-TEC, Constellium Technology Center
  2. Engineering and Physical Sciences Research Council (EPSRC) through the NewWire Additive Manufacturing [EP/R027218/1]
  3. EPSRC [EP/R027218/1] Funding Source: UKRI

向作者/读者索取更多资源

The research investigated the effect of substrate type on the interface microstructure in an aluminium part, revealing how substrate alloy and temper impact the interface between the substrate and deposited material. The study also found microcracks in the as-deposited condition were only present in one substrate, with deposited material hardness consistently lower than substrate hardness.
Wire + Arc Additive Manufacture is an Additive Manufacturing process that requires a substrate to initiate the deposition process. In order to reduce material waste, build and lead time, and improve process efficiency, it is desirable to include this substrate in the final part design. This approach is a valid option only if the interface between the substrate and the deposited metal properties conform to the design specifications. The effect of substrate type on the interface microstructure in an aluminium part was investigated. Microstructure and micro-hardness measurements show the effect of substrate alloy and temper on the interface between the substrate and deposited material. Microcracks in the as-deposited condition were only found in one substrate. The deposited material hardness is always lower than the substrate hardness. However, this difference can be minimised by heat treatment and even eliminated when the substrate and wire are made of the same alloy. Dataset License: CC0

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.5
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据