The removal mechanism and force modelling of gallium oxide single crystal in single grit grinding and nanoscratching

Critique of materials‐based models of ductile machining in brittle solids

(2020) Han Huang et al.   JOURNAL OF THE AMERICAN CERAMIC SOCIETY

Micromechanics of Machining and Wear in Hard and Brittle Materials

(2020) Brian R Lawn et al.   JOURNAL OF THE AMERICAN CERAMIC SOCIETY

Science and art of ductile grinding of brittle solids

(2020) Han Huang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

A novel lapping process for single-crystal sapphire using hybrid nanoparticle suspensions

(2020) Shuiquan Huang et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Deformation mechanism and force modelling of the grinding of YAG single crystals

(2019) Chen Li et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Recent progress in the growth of β-Ga 2 O 3 for power electronics applications

(2018) Michele Baldini et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Nanogrinding induced surface and deformation mechanism of single crystal β-Ga 2 O 3

(2018) Shang Gao et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Identification of the critical depth-of-cut through a 2D image of the cutting region resulting from taper cutting of brittle materials

(2018) Wen Gu et al.   MEASUREMENT SCIENCE and TECHNOLOGY

A review of Ga2O3 materials, processing, and devices

(2018) S. J. Pearton et al.   Applied Physics Reviews

Single diamond grain cutting-edges morphology effect on grinding mechanism of Inconel 718

(2018) Chen-Wei Dai et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Stacking faults in β-Ga2O3 crystals observed by X-ray topography

(2018) Hirotaka Yamaguchi et al.   JOURNAL OF APPLIED CRYSTALLOGRAPHY

Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained using compression of micro-pillars

(2018) Y. Q. Wu et al.   JOURNAL OF MATERIALS SCIENCE

The deformation pattern of single crystal β-Ga 2 O 3 under nanoindentation

(2017) Y.Q. Wu et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Prediction of critical cutting depth for ductile-brittle transition in ultrasonic vibration assisted grinding of optical glasses

(2016) Ming Zhou et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Mechanical load-induced interfacial failure of a thin film multilayer in nanoscratching and diamond lapping

(2016) Chengwei Kang et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Slip system analysis and X-ray topographic study on β-Ga2O3

(2016) Hirotaka Yamaguchi et al.   SUPERLATTICES AND MICROSTRUCTURES

Deep ultraviolet photodiodes based on β-Ga2O3/SiC heterojunction

(2013) Shinji Nakagomi et al.   APPLIED PHYSICS LETTERS

Influence of the clearance angle on the cutting efficiency of blunt, octahedral-shaped diamonds in an active filler alloy

(2013) Robert Transchel et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

On the influence of single grit micro-geometry on grinding behavior of ductile and brittle materials

(2013) D. Axinte et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Analysis of ductile mode and brittle transition of AFM nanomachining of silicon

(2012) Seoung Hwan Lee   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Characterization of the transition from ploughing to cutting in micro machining and evaluation of the minimum thickness of cut

(2011) A. Cuba Ramos et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

A study on the diamond grinding of ultra-thin silicon wafers

(2011) L Zhou et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material

(2010) Zhenyu Zhang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Nanoscratch-induced phase transformation of monocrystalline Si

(2010) Y.Q. Wu et al.   SCRIPTA MATERIALIA

Surface characteristics and removal mechanism of cemented tungsten carbides in nanoscratching

(2010) H.Q. Sun et al.   WEAR

A New Model for Grinding Force Prediction and Analysis

(2009) U.S. Patnaik Durgumahanti et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE