High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

标题
High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
作者
关键词
A. Polymer-matrix composites, B. Thermal properties, B. Mechanical properties, D. Rheology
出版物
出版商
Elsevier BV
发表日期
2018-12-22
DOI
10.1016/j.compositesa.2018.12.019

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