A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics

标题
A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
作者
关键词
flexible electronics, self-assembled monolayer, inkjet printing, catalytic ink, electroless deposition
出版物
ELECTROCHIMICA ACTA
Volume 218, Issue -, Pages 24-31
出版商
Elsevier BV
发表日期
2016-09-10
DOI
10.1016/j.electacta.2016.08.143

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