标题
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2021-01-17
DOI
10.1007/s11664-020-08697-4
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
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