Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
出版年份 2020 全文链接
标题
Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives
作者
关键词
A. Thermosetting resin, B. Cure behavior, B. Mechanical properties, D. Thermal analysis
出版物
COMPOSITES PART B-ENGINEERING
Volume 202, Issue -, Pages 108438
出版商
Elsevier BV
发表日期
2020-09-29
DOI
10.1016/j.compositesb.2020.108438
参考文献
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