4.7 Article

Combinatorial Synthesis and High-Throughput Characterization of Microstructure and Phase Transformation in Ni-Ti-Cu-V Quaternary Thin-Film Library

期刊

ENGINEERING
卷 6, 期 6, 页码 637-643

出版社

ELSEVIER
DOI: 10.1016/j.eng.2020.05.003

关键词

Ni-Ti-Cu-V alloys; Combinatorial materials science; Quaternary alloys; Shape memory alloys; Thin-film library; Elastocaloric cooling; Thermoelastic cooling; Phase transformation; High-throughput characterization; Property mapping; Machine learning

资金

  1. National Science Foundation [DGE 1322106]

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Ni-Ti-based shape memory alloys (SMAs) have found widespread use in the last 70 years, but improving their functional stability remains a key quest for more robust and advanced applications. Named for their ability to retain their processed shape as a result of a reversible martensitic transformation, SMAs are highly sensitive to compositional variations. Alloying with ternary and quaternary elements to fine-tune the lattice parameters and the thermal hysteresis of an SMA, therefore, becomes a challenge in materials exploration. Combinatorial materials science allows streamlining of the synthesis process and data management from multiple characterization techniques. In this study, a composition spread of Ni-Ti-Cu-V thin-film library was synthesized by magnetron co-sputtering on a thermally oxidized Si wafer. Composition-dependent phase transformation temperature and microstructure were investigated and determined using high-throughput wavelength dispersive spectroscopy, synchrotron X-ray diffraction, and temperature-dependent resistance measurements. Of the 177 compositions in the materials library, 32 were observed to have shape memory effect, of which five had zero or near-zero thermal hysteresis. These compositions provide flexibility in the operating temperature regimes that they can be used in. A phase map for the quaternary system and correlations of functional properties are discussed with respect to the local microstructure and composition of the thin-film library. (C) 2020 THE AUTHORS. Published by Elsevier LTD on behalf of Chinese Academy of Engineering and Higher Education Press Limited Company.

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