Interfacial Band Engineering of MoS 2 /Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts

标题
Interfacial Band Engineering of MoS 2 /Gold Interfaces Using Pyrimidine‐Containing Self‐Assembled Monolayers: Toward Contact‐Resistance‐Free Bottom‐Contacts
作者
关键词
-
出版物
Advanced Electronic Materials
Volume 6, Issue 5, Pages 2000110
出版商
Wiley
发表日期
2020-03-19
DOI
10.1002/aelm.202000110

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