Reliability improvements of thin film platinum resistors on wafer-level and micro-hotplates at stress temperatures in the range of 140–290 °C

出版年份 2019 全文链接

标题

作者

关键词

出版物

Volume 104, Issue -, Pages 113557

出版商

Elsevier BV

发表日期

2019-12-13

DOI

10.1016/j.microrel.2019.113557

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