Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach

标题
Effect of relative tool sharpness on subsurface damage and material recovery in nanometric cutting of mono-crystalline silicon: A molecular dynamics approach
作者
关键词
-
出版物
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 108, Issue -, Pages 104868
出版商
Elsevier BV
发表日期
2019-12-05
DOI
10.1016/j.mssp.2019.104868

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