Enhancement of Thermal Conductivity and Mechanical Properties of Cu-Reduced Graphene Oxide Composites by Interface Modification

标题
Enhancement of Thermal Conductivity and Mechanical Properties of Cu-Reduced Graphene Oxide Composites by Interface Modification
作者
关键词
copper matrix, graphene, interfacial bonding, mechanical properties, thermal conductivity
出版物
出版商
Springer Science and Business Media LLC
发表日期
2019-07-17
DOI
10.1007/s11665-019-04212-x

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started