标题
Sawing stress of SiC single crystal with void defect in diamond wire saw slicing
作者
关键词
SiC single crystal, Wire saw, Sawing stress, void defect, Finite element analysis
出版物
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume -, Issue -, Pages -
出版商
Springer Nature
发表日期
2019-03-29
DOI
10.1007/s00170-019-03579-4
参考文献
相关参考文献
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