Thin Solid Films

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期刊名

Thin Solid Films

THIN SOLID FILMS

ISSN / eISSN

0040-6090

目标和范围

Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.

研究方向

材料科学：膜

材料科学：综合

物理：应用

CiteScore

4.40

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CiteScore 学科排名

类别	分区	排名
Materials Science - Metals and Alloys	Q1	#39/164
Materials Science - Surfaces and Interfaces	Q2	#22/55
Materials Science - Surfaces, Coatings and Films	Q2	#52/131
Materials Science - Materials Chemistry	Q2	#123/306
Materials Science - Electronic, Optical and Magnetic Materials	Q2	#110/271

Web of Science 核心合集

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
Indexed	-

类别 (Journal Citation Reports 2023)	分区
MATERIALS SCIENCE, COATINGS & FILMS - SCIE	Q4
MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE	Q3
PHYSICS, APPLIED - SCIE	Q3
PHYSICS, CONDENSED MATTER - SCIE	Q3

H-index

175

出版国家或地区

NETHERLANDS

出版商

Elsevier

出版周期

Semimonthly

出版年份

1967

年文章数

411

Open Access

通讯方式

ELSEVIER SCIENCE SA, PO BOX 564, LAUSANNE, SWITZERLAND, 1001

同领域相关热门期刊
近期发表文章

A thermochemical understanding of the factors that govern the growth of chemical bath deposition of Cu2O thin films: (2023) T. Hildebrandt, L. Mathon-Claudon, N. Naghavi

In-situ/operando characterization of FeOx-based chemiresistive sensor of acetone vapours by x-ray absorption spectroscopy: (2023) Ján Ivančo, Simone Pollastri, Monika Hofbauerová

Improved photostability of mixed-cation perovskite microplatelets fabricated by a chemical vapor deposition method: (2023) Yongfeng Qiu, Cairong Chen, Hui Lu

Deposition-controlled phase separation in CuNb metallic alloys: (2023) Benjamin K. Derby, Lucia R. Gomez-Hurtado, Guild Copeland, Khalid Hattar, Samuel Briggs

Development of direct current magnetron sputtered TiO2−x thin films as buffer layers for copper indium gallium diselenide based solar cells: (2023) David Stock, Nikolaus Weinberger, Florian Ruske, Leander Haug, Martina Harnisch, Roman Lackner

Enhancing analysis efficiency: Automation of spectroscopic ellipsometry for crystalline semiconductors and transparent conductive oxides: (2023) Sara Maeda, Yusuke Tani, Hirotaka Katayama, Daiji Kanematsu, Kohei Oiwake, Yukinori Nishigaki, Tetsuhiko Miyadera, Masayuki Chikamatsu, Takayuki Nagai...

Tuning microstructure and properties of MoNbTaWZr high entropy alloy films by adjusting the parameters in high power impulse magnetron sputtering: (2023) Georg C. Gruber, Alice Lassnig, Stefan Wurster, Christoph Gammer, Megan J. Cordill, Robert Franz

Synergistic effect on silicon surface under low energy he ion irradiation at elevated temperatures: (2023) Nicholas C. Termini, Jitendra K. Tripathi, Ahmed Hassanein

A comparative study of photoelectric performance of Ga2O3 solar-blind photodetectors with symmetric and asymmetric electrodes: (2023) Chien-Yie Tsay, Hsuan-Meng Tsai, Phongsaphak Sittimart, Sreenath Mylo Valappil, Takafumi Kusaba, Tsuyoshi Yoshitake

Co-deposition of Co-Fe alloy catalysts for hydrogen evolution reaction based on ethylene glycol system: (2023) Xinkuai He, Ruqing Guo, Qingtian Zou, Jingjing Yang, Zhousi Hu, Luye Wu

认证评论

注：认证评论选取于全球各个学术评论平台和社交媒体。

It has been more than 10 days since submission, and the editor hasn't processed it yet. It's still in the submission stage to the journal. It's too slow, and I feel like it's dragging on. I want to withdraw my submission and submit elsewhere. Does anyone know how to withdraw a submission?

2022-02-15

It seems like my complaint was heard by the editor. After waiting for over five months, my manuscript was rejected today. In the end, I was reaching too high with TSF. I will never submit to TSF again. I wish them the best in their future endeavors...

2022-04-13

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