Scratch formation and its mechanism in chemical mechanical planarization (CMP)

Investigation of Source-Based Scratch Formation During Oxide Chemical Mechanical Planarization

(2013) Tae-Young Kwon et al.   TRIBOLOGY LETTERS

Nano-Scale Stick-Slip Friction Model for the Chatter Scratch Generated by Chemical Mechanical Polishing Process

(2012) Hong Jin Kim et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation

(2011) Y. Nagendra Prasad et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Breaking-In a Pad for Scratch-Free, Cu Chemical-Mechanical Polishing

(2011) T. Eusner et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Process development of high-k metal gate aluminum CMP at 28nm technology node

(2011) Y.H. Hsien et al.   MICROELECTRONIC ENGINEERING

Scratching by pad asperities in chemical–mechanical polishing

(2010) N. Saka et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Effect of CMP conditioner diamond shape on pad topography and oxide wafer performances

(2010) Ming Yi Tsai et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes

(2010) Ji Chul Yang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

(2010) Ji Chul Yang et al.   JOURNAL OF ELECTRONIC MATERIALS

The Synergetic Role of Pores and Grooves of the Pad on the Scratch Formation during STI CMP

(2010) Jae-Gon Choi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization

(2010) Jae-Gon Choi et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Optimization of CMP Pad Surface by Laser Induced Micro Hole

(2010) Ji Chul Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

(2009) Mahadevaiyer Krishnan et al.   CHEMICAL REVIEWS

Method for Quantifying the Degree of Agglomeration in Highly Stable Chemical Mechanical Polishing Slurries

(2009) Feng-Chi Chang et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Novel ceria–polymer microcomposites for chemical mechanical polishing

(2008) Cecil A. Coutinho et al.   APPLIED SURFACE SCIENCE

Nano-scale scratching in chemical–mechanical polishing

(2008) N. Saka et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Prediction of scratch generation in chemical mechanical planarization

(2008) A. Chandra et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Enhancement of CMP pad lifetime for shallow trench isolation process using profile simulation

(2008) Woo-Jin Lee et al.   CURRENT APPLIED PHYSICS

Frictional Characterization of Chemical–Mechanical Polishing Pad Surface and Diamond Conditioner Wear

(2008) Yohei Yamada et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing

(2008) T. Suratwala et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS

Composite Polymer Core–Silica Shell Abrasives: The Effect of the Shape of the Silica Particles on Oxide CMP

(2008) S. Armini et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of CMP Slurries and Post-CMP Cleaning Solutions on Cu Interconnects and TDDB Reliability

(2008) Yohei Yamada et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Interaction Forces Between a Glass Surface and Ceria-Modified PMMA-Based Abrasives for CMP Measured by Colloidal Probe AFM

(2008) Silvia Armini et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of Stress-Induced Particle Agglomeration on Defectivity during CMP of Low-k Dielectrics

(2008) Feng-Chi Chang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY