Impact of device size and thickness of Al2O3 film on the Cu pillar and resistive switching characteristics for 3D cross-point memory application

标题
Impact of device size and thickness of Al2O3 film on the Cu pillar and resistive switching characteristics for 3D cross-point memory application
作者
关键词
Resistive switching, Al<sub>2</sub>O<sub>3</sub>, Cu pillar, 3D memory, CBRAM
出版物
Nanoscale Research Letters
Volume 9, Issue 1, Pages 692
出版商
Springer Nature
发表日期
2015-06-18
DOI
10.1186/1556-276x-9-692

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