Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications

Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

(2009) R. Sanapala et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Flame Retardancy Mechanisms of Aluminium Phosphinate in Combination with Melamine Cyanurate in Glass-Fibre-Reinforced Poly(1,4-butylene terephthalate)

(2008) Ulrike Braun et al.   MACROMOLECULAR MATERIALS AND ENGINEERING

Thermal and physical properties of flame-retardant epoxy resins containing 2-(6-oxido-6H-dibenz〈c,e〉〈1,2〉oxaphosphorin-6-yl)-1,4-naphthalenediol and cured with dicyanate ester

(2008) Tsung-Han Ho et al.   POLYMER DEGRADATION AND STABILITY

Novel efficient DOPO-based flame-retardants for PWB relevant epoxy resins with high glass transition temperatures

(2008) M. Ciesielski et al.   POLYMERS FOR ADVANCED TECHNOLOGIES

Phosphorus-containing terephthaldialdehyde adducts—Structure determination and their application as flame retardants in epoxy resins

(2007) S. Seibold et al.   JOURNAL OF APPLIED POLYMER SCIENCE

Novel high Tg flame retardancy approach for epoxy resins

(2007) A. Schäfer et al.   POLYMER DEGRADATION AND STABILITY