4.4 Article

Room Temperature CVD of TiO2 Thin Films and Their Electronic Properties

期刊

SCIENCE OF ADVANCED MATERIALS
卷 1, 期 2, 页码 138-143

出版社

AMER SCIENTIFIC PUBLISHERS
DOI: 10.1166/sam.2009.1036

关键词

TiO2; Thin Film; Chemical Vapor Deposition; TiO2-SiO2; Metal Oxide Semiconductor-Field Effect Transistor (MOS-FET); Equivalent Oxide Thickness (EOT)

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Amorphous TiO2 thin films and TiO2-SiO2 thin films were deposited for use in the gate oxide of Metal Oxide Semiconductor-Field Effect Transistor (MOS-FET). They were deposited by a novel CVD method using hydrolysis of Titanium IV isopropoxide and Tetra ethyl ortho silicate at room temperature and atmospheric pressure. Root mean square (RMS) of as-deposited TiO2 films was 0.28 nm. TiO2 films annealed at 400 degrees C in air showed anatase phase, but TiO2-SiO2 films didn't crystallize below 700 degrees C. Dielectric constants of TiO2 films and TiO2-SiO2 films were about 40 and 20, respectively. Minima of equivalent oxide thickness of as-deposited TiO2 films and TiO2-SiO2 films were about 3.9 nm and 4.2 nm, respectively.

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