3D strain measurement in electronic devices using through-focal annular dark-field imaging

出版年份 2014 全文链接

标题

3D strain measurement in electronic devices using through-focal annular dark-field imaging

作者

关键词

-

出版物

ULTRAMICROSCOPY

Volume 146, Issue -, Pages 1-5

出版商

Elsevier BV

发表日期

2014-05-11

DOI

10.1016/j.ultramic.2014.04.010

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Protocol

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