Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias

标题
Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias
作者
关键词
-
出版物
THIN SOLID FILMS
Volume 516, Issue 16, Pages 5194-5200
出版商
Elsevier BV
发表日期
2007-07-14
DOI
10.1016/j.tsf.2007.07.058

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