Nanomechanical Analysis of Etched Si Surface for Adaptively Coupled Plasma Etching System for Sub-20 nm SADP Process Applications

标题
Nanomechanical Analysis of Etched Si Surface for Adaptively Coupled Plasma Etching System for Sub-20 nm SADP Process Applications
作者
关键词
-
出版物
Science of Advanced Materials
Volume 7, Issue 1, Pages 133-138
出版商
American Scientific Publishers
发表日期
2015-01-15
DOI
10.1166/sam.2015.2092

向作者/读者发起求助以获取更多资源

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation