期刊
OPTICS EXPRESS
卷 18, 期 17, 页码 18339-18346出版社
OPTICAL SOC AMER
DOI: 10.1364/OE.18.018339
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We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 mu m and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 mu m (k = 1) using a preliminary setup. (C) 2010 Optical Society of America
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