In-Situ Quantification of TEM Lamella Thickness and Ga Implantation in the FIB

标题
In-Situ Quantification of TEM Lamella Thickness and Ga Implantation in the FIB
作者
关键词
-
出版物
MICROSCOPY AND MICROANALYSIS
Volume 20, Issue S3, Pages 342-343
出版商
Cambridge University Press (CUP)
发表日期
2014-08-27
DOI
10.1017/s1431927614003432

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