Non-destructive imaging of defects in Ag-sinter die attach layers – A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography

出版年份 2018 全文链接

标题

作者

关键词

出版物

MICROELECTRONICS RELIABILITY

Volume -, Issue -, Pages -

出版商

Elsevier BV

发表日期

2018-09-30

DOI

10.1016/j.microrel.2018.07.121

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

MICROELECTRONICS RELIABILITY

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Discover Peeref hubs

Create your own webinar