Modelling the self-alignment of passive chip components during reflow soldering

标题
Modelling the self-alignment of passive chip components during reflow soldering
作者
关键词
-
出版物
MICROELECTRONICS RELIABILITY
Volume 54, Issue 2, Pages 457-463
出版商
Elsevier BV
发表日期
2013-11-01
DOI
10.1016/j.microrel.2013.10.010

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