Improved thermal management for GaN power electronics: Silver diamond composite packages

出版年份 2012 全文链接

标题

Improved thermal management for GaN power electronics: Silver diamond composite packages

作者

关键词

-

出版物

MICROELECTRONICS RELIABILITY

Volume 52, Issue 12, Pages 3022-3025

出版商

Elsevier BV

发表日期

2012-08-11

DOI

10.1016/j.microrel.2012.06.119

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Protocol

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