Electromigration failure in a copper dual-damascene structure with a through silicon via

标题
Electromigration failure in a copper dual-damascene structure with a through silicon via
作者
关键词
-
出版物
MICROELECTRONICS RELIABILITY
Volume 52, Issue 9-10, Pages 1981-1986
出版商
Elsevier BV
发表日期
2012-08-06
DOI
10.1016/j.microrel.2012.07.021

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