Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges

标题
Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges
作者
关键词
-
出版物
MICROELECTRONICS RELIABILITY
Volume 48, Issue 6, Pages 923-932
出版商
Elsevier BV
发表日期
2008-04-26
DOI
10.1016/j.microrel.2008.02.004

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