Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists

标题
Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists
作者
关键词
-
出版物
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 88, Issue -, Pages 132-138
出版商
Elsevier BV
发表日期
2018-08-14
DOI
10.1016/j.mssp.2018.08.005

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