Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

标题
Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder
作者
关键词
-
出版物
MATERIALS LETTERS
Volume 92, Issue -, Pages 278-280
出版商
Elsevier BV
发表日期
2012-10-31
DOI
10.1016/j.matlet.2012.10.063

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