期刊
MATERIALS LETTERS
卷 81, 期 -, 页码 155-157出版社
ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2012.05.015
关键词
Thin films; Adhesion; Chemical vapor deposition; Interlayer; Electroplating
资金
- Natural Science Foundation of China [51071070, 50971062]
Large area diamond films were successfully fabricated on copper (Cu) substrates by first electroplating a Cu-diamond composite layer with a tiny amount (0.05-0.1 wt.%) of chromium (Cr) in Cu and then growing the continuous diamond film on the composite interlayer by hot-filament chemical vapor deposition (HFCVD). The interfacial characteristics were investigated in detail by scanning electron microscopy and indentation test. The results show that using this new approach, the diamond coating could be firmly adhered to the substrate during rapid cooling after HFCVD. Doping Cr into the Cu-diamond composite interlayer and anchoring the diamond particles deep in the Cu(Cr) matrix are responsible for the much improved interface adhesion between coating and substrate. (C) 2012 Elsevier B.V. All rights reserved.
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