A facile solution-immersion process for the fabrication of superhydrophobic surfaces with high water adhesion

The present work reports a simple and effective way to produce copper compound films on zinc substrate via solution-immersion process. The surfaces were characterized by field-emission scanning electron microscopy, Fourier transform IR. X-ray photoelectron spectrum and X-ray powder diffraction. The wettability of the surfaces is also investigated. The as-prepared superhydrophobic surfaces exhibit high adhesion to water and scratches on the surfaces could be repaired by immersing the damaged samples into the solution again. (C) 2011 Elsevier B.V. All rights reserved.