Low-k SiCxNyFilms Prepared by Plasma-Enhanced Chemical Vapor Deposition Using 1,3,5-trimethyl-1,3,5-trivinylcyclotrisilazane Precursor

Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-kFilms

(2011) Ippei Kume et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Silicon Carbonitride (SiCN) Films by Remote Hydrogen Microwave Plasma CVD from Tris(dimethylamino)silane as Novel Single-Source Precursor

(2010) Aleksander M. Wrobel et al.   CHEMICAL VAPOR DEPOSITION

Single-Chamber Deposition of Multilayer Barriers by Plasma Enhanced and Initiated Chemical Vapor Deposition of Organosilicones

(2010) Anna Maria Coclite et al.   Plasma Processes and Polymers

Leakage current and paramagnetic defects in SiCN dielectrics for copper diffusion barriers

(2008) Kiyoteru Kobayashi et al.   APPLIED SURFACE SCIENCE

Hard and High-Temperature-Resistant Silicon Carbonitride Coatings Based on N-Silyl-Substituted Cyclodisilazane Rings

(2008) A. M. Wrobel et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Conversion of a plasma enhanced chemical vapor deposited silicon–carbon–nitride thin film at ultra-low temperature by oxygen plasma

(2007) Steven M. Smith et al.   THIN SOLID FILMS