A Study of the Colloidal Stability of Mixed Abrasive Slurries and Their Role in CMP

Polymer Adsorption Effects on Colloidal Stabilities of Ceria Particles and Chemical Mechanical Polishing of Silicone Oxide Films by Ceria Particles

(2010) Naoki Nishiguchi et al.   JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY

ILD CMP with Silica Abrasive Particles: Interfacial Removal Kinetics and Effect of Pad Surface Textures

(2010) Shoutian Li et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms

(2009) Mahadevaiyer Krishnan et al.   CHEMICAL REVIEWS

Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

(2009) P. R. Dandu Veera et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Preparation of silica/ceria nano composite abrasive and its CMP behavior on hard disk substrate

(2009) Hong Lei et al.   MICROELECTRONIC ENGINEERING

Role of abrasives in high selectivity STI CMP slurries

(2008) R. Manivannan et al.   MICROELECTRONIC ENGINEERING

Adsorption behavior of anionic polyelectrolyte for chemical mechanical polishing (CMP)

(2007) Sarah Kim et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE