Pulse-Plating of Copper-Silver Alloys for Interconnect Applications

Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection

(2011) Igor Volov et al.   JOURNAL OF SEPARATION SCIENCE

Investigation of Copper Plating and Additive Interactions in the Presence of Fe3+/Fe2+ Redox Couple

(2011) Igor Volov et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Characterization and Purification of Commercial SPS and MPS by Ion Chromatography and Mass Spectrometry

(2011) Ryan G. Brennan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Interaction between SPS and MPS in the Presence of Ferrous and Ferric Ions

(2011) Igor Volov et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Polyether Suppressors Enabling Copper Metallization of High Aspect Ratio Interconnects

(2009) Julie Mendez et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Filling of 100 nm Trenches Using PEG, PPG, and a Triblock Copolymer as Plating Suppressors

(2009) Joshua W. Gallaway et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Acceleration Kinetics of PEG, PPG, and a Triblock Copolymer by SPS during Copper Electroplating

(2009) Joshua W. Gallaway et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

(2009) S. Strehle et al.   MICROELECTRONIC ENGINEERING

Electroplating of Cu(Ag) thin films for interconnect applications

(2009) S. Strehle et al.   MICROELECTRONIC ENGINEERING

PEG, PPG, and Their Triblock Copolymers as Suppressors in Copper Electroplating

(2008) Joshua W. Gallaway et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electrical properties of electroplated Cu(Ag) thin films

(2008) S. Strehle et al.   THIN SOLID FILMS

Enhancement of filling performance of a copper plating formula at low chloride concentration

(2007) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA