In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating

Characterization of “Ultrathin-Cu”/Ru(Ta)/TaN Liner Stack for Copper Interconnects

(2010) C.-C Yang et al.   IEEE ELECTRON DEVICE LETTERS

Enhancement of Electrochemical Capacitance Using Ni-Modified Carbon Nanofibers Prepared by a Hydrothermal Process

(2010) Chih-Ming Chuang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Amorphous RuW Film as a Diffusion Barrier for Advanced Cu Metallization

(2010) Jia-Bin Yeh et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

(2009) Dung-Ching Perng et al.   APPLIED SURFACE SCIENCE

Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier

(2009) Jung-Dae Kwon et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Pore sealing of mesoporous silica low-k dielectrics by oxygen and argon plasma treatments

(2009) Chih-Chieh Chang et al.   MICROELECTRONIC ENGINEERING

Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier

(2009) Dung-Ching Perng et al.   MICROELECTRONIC ENGINEERING

A novel thermally-stable zirconium amidinate ALD precursor for ZrO2 thin films

(2008) B. Lee et al.   MICROELECTRONIC ENGINEERING