Pore sealing of mesoporous silica low-k dielectrics by oxygen and argon plasma treatments

标题
Pore sealing of mesoporous silica low-k dielectrics by oxygen and argon plasma treatments
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 86, Issue 11, Pages 2241-2246
出版商
Elsevier BV
发表日期
2009-03-31
DOI
10.1016/j.mee.2009.03.127

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