Thermal Stability and Performance of NbSiTaTiZr High-Entropy Alloy Barrier for Copper Metallization

Ru incorporation on marked enhancement of diffusion resistance of multi-component alloy barrier layers

(2010) Shou-Yi Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

(AlCrTaTiZr)N/(AlCrTaTiZr)N0.7 bilayer structure of high resistance to the interdiffusion of Cu and Si at 900°C

(2010) Shou-Yi Chang et al.   MATERIALS CHEMISTRY AND PHYSICS

Inhibition of grain coarsening up to 1000°C in (AlCrNbSiTiV)N superhard coatings

(2010) Ping-Kang Huang et al.   SCRIPTA MATERIALIA

Effect of annealing on atomic ordering of amorphous ZrTaTiNbSi alloy

(2009) Tsung-Han Yang et al.   APPLIED PHYSICS LETTERS

10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 °C

(2009) Shou-Yi Chang et al.   APPLIED PHYSICS LETTERS

Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization

(2008) Ming-Hung Tsai et al.   APPLIED PHYSICS LETTERS

Diffusion barrier properties of AlMoNbSiTaTiVZr high-entropy alloy layer between copper and silicon

(2007) Ming-Hung Tsai et al.   THIN SOLID FILMS