Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing

Optimized pitch button blocking for polishing high-aspect-ratio optics

(2012) Michael D. Feit et al.   APPLIED OPTICS

Convergent Pad Polishing of Amorphous Silica

(2012) Tayyab Suratwala et al.   International Journal of Applied Glass Science

Effects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing

(2011) Hojoong Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Cerium Oxide Particle Sizes in Oxide Chemical Mechanical Planarization

(2009) Yasa Sampurno et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Controlling Scratching in Cu Chemical Mechanical Planarization

(2009) T. Eusner et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of rogue particles on the sub-surface damage of fused silica during grinding/polishing

(2008) T. Suratwala et al.   JOURNAL OF NON-CRYSTALLINE SOLIDS