标题
Studies of the ductile mode of cutting brittle materials (A review)
作者
关键词
-
出版物
Journal of Superhard Materials
Volume 35, Issue 5, Pages 259-276
出版商
Allerton Press
发表日期
2013-11-06
DOI
10.3103/s1063457613050018
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Mechanical Strength of Silicon Wafers Cut by Loose Abrasive Slurry and Fixed Abrasive Diamond Wire Sawing
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- Roughness damage evolution due to wire saw process
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- Fabricating Nano Ribbons and Nano Fibers of Semiconductor Materials by Diamond Turning
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- Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon
- (2008) X P Li et al. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE
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- Effect of counterpart on the tribological behavior and tribo-induced phase transformation of Si
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- Tribological behavior and phase transformation of single-crystal silicon in air
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