Deposition of hard thin films from HMDSO in atmospheric pressure dielectric barrier discharge

An atmospheric pressure dielectric barrier discharge burning in nitrogen with a small admixture of hexamethyldisiloxane (HMDSO) was used for the deposition of thin organosilicon films. The thin films were deposited on glass, silicon and polycarbonate substrates, and the substrate temperature during the deposition process was increased up to values within the range 25-150 degrees C in order to obtain hard SiOx-like thin films. The properties of the discharge were studied by means of optical emission spectroscopy and electrical measurements. The deposited films were characterized by the Rutherford backscattering and elastic recoil detection methods, x-ray photoelectron spectroscopy, infrared spectroscopy measurements, ellipsometry and the depth sensing indentation technique. It was found that the films' properties depend significantly on the substrate temperature at deposition. An increase in substrate temperature from 25 to 150 degrees C led to an increase in film hardness from 0.4 to 7 GPa and the film chemical composition changed from CHxSiyOz to SiOxHy. The films were transparent in the visible range.