A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads

标题
A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads
作者
关键词
-
出版物
Journal of Mechanical Science and Technology
Volume 26, Issue 8, Pages 2353-2364
出版商
Springer Nature
发表日期
2012-08-22
DOI
10.1007/s12206-012-0613-2

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