Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

标题
Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization
作者
关键词
-
出版物
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 209, Issue 4, Pages 1729-1735
出版商
Elsevier BV
发表日期
2008-04-19
DOI
10.1016/j.jmatprotec.2008.04.021

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