Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

(2012) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

(2011) Z. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints

(2010) Xiaoyan Li et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties

(2009) I. Dutta et al.   JOM

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

(2009) Lihua Qi et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints

(2008) P. Limaye et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components

(2008) C. Andersson et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading

(2007) J.W. Ronnie Teo et al.   ACTA MATERIALIA