Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications

出版年份 2009 全文链接

标题

作者

关键词

出版物

Volume 38, Issue 12, Pages 2735-2745

出版商

Springer Nature

发表日期

2009-08-05

DOI

10.1007/s11664-009-0898-9

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