Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites

标题
Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites
作者
关键词
damage evolution, interface debonding, microstructure-based model, SiC<sub>p</sub>/Al composites
出版物
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
Volume 23, Issue 3, Pages 1069-1076
出版商
Springer Nature
发表日期
2013-12-04
DOI
10.1007/s11665-013-0805-7

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now