Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

标题
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
作者
关键词
-
出版物
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2009-12-12
DOI
10.1109/tcapt.2009.2021256

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