Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate

Inkjet Printing of Conjugated Polymer Precursors on Paper Substrates for Colorimetric Sensing and Flexible Electrothermochromic Display

(2011) Bora Yoon et al.   ADVANCED MATERIALS

Inkjet Printing of Low-Temperature Cured Silver Patterns by Using AgNO3/1-Dimethylamino-2-propanol Inks on Polymer Substrates

(2011) Jung-Tang Wu et al.   Journal of Physical Chemistry C

Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics

(2011) Zhiliang Zhang et al.   NANOTECHNOLOGY

Effect of UV/ozone treatment on interactions between ink-jet printed Cu patterns and polyimide substrates

(2011) Young-In Lee et al.   THIN SOLID FILMS

Inkjet-Printed Single-Droplet Organic Transistors Based on Semiconductor Nanowires Embedded in Insulating Polymers

(2010) Jung Ah Lim et al.   ADVANCED FUNCTIONAL MATERIALS

Inkjet Printing of Functional and Structural Materials: Fluid Property Requirements, Feature Stability, and Resolution

(2010) Brian Derby   Annual Review of Materials Research

Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition

(2010) Yinxiang Lu   APPLIED SURFACE SCIENCE

Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligands†

(2010) Stephan F. Jahn et al.   CHEMISTRY OF MATERIALS

Effect of Complex Agent on Characteristics of Copper Conductive Pattern Formed by Ink-jet Printing

(2010) Young-In Lee et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

(2010) Jolke Perelaer et al.   JOURNAL OF MATERIALS CHEMISTRY

High-strength nanoporous silver produced by inkjet printing

(2010) Rui Dou et al.   SCRIPTA MATERIALIA

A low-cure-temperature copper nano ink for highly conductive printed electrodes

(2009) Byoungyoon Lee et al.   CURRENT APPLIED PHYSICS

Conductive copper and nickel lines via reactive inkjet printing

(2009) Dapeng Li et al.   JOURNAL OF MATERIALS CHEMISTRY

Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing

(2009) Michael Grouchko et al.   JOURNAL OF MATERIALS CHEMISTRY

Inkjet printed, conductive, 25 μm wide silver tracks on unstructured polyimide

(2009) Henning Meier et al.   PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE

Toward a comprehensive understanding of solid-state core-level XPS linewidths: Experimental and theoretical studies on theSi 2pandO 1slinewidths in silicates

(2009) G. M. Bancroft et al.   PHYSICAL REVIEW B

Adhesion Improvement of Polyimide/Metal Interface by He/O2/NF3Atmospheric Pressure Plasma

(2009) Su Bin Lee et al.   Plasma Processes and Polymers

Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes

(2009) B. Y. Ahn et al.   SCIENCE

Nanosized Glass Frit as an Adhesion Promoter for Ink-Jet Printed Conductive Patterns on Glass Substrates Annealed at High Temperatures

(2008) Daehwan Jang et al.   ADVANCED FUNCTIONAL MATERIALS

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS

Inkjet-printed electrochromic devices utilizing polyaniline–silica and poly(3,4-ethylenedioxythiophene)–silica colloidal composite particles

(2008) Goo Hwan Shim et al.   JOURNAL OF MATERIALS CHEMISTRY

Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics

(2008) Youngil Lee et al.   NANOTECHNOLOGY