期刊
JOURNAL OF ELECTRONIC PACKAGING
卷 131, 期 2, 页码 -出版社
ASME
DOI: 10.1115/1.3103931
关键词
finite volume methods; heat sinks; heat transfer; laminar flow; microchannel flow; Navier-Stokes equations; polynomial approximation; quadratic programming; response surface methodology; thermal resistance
资金
- Basic Research Program of the Korea Science and Engineering Foundation [R01-2006-00010039-0]
- National Research Foundation of Korea [과C6A1806] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier-Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据